Cedatec Multilayer Inductive Bonding model 200
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機能・特性
- By inductive-magnetic heating system, there's no limit on layer-count. The most advanced 8G induction bonding system is faster in heating rate 50% more than previous generation with a low-power consumption.
製品情報
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Manufacturer
Cedatec -
Manufacturing process
Lamination/Drilling/Routing process -
Product
Multilayer Inductive Bonding model 200
