SIKAMA Reflow Oven UP1200
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機能・特性
- The maximum temperature up to 400℃ and temperature uniformity ±2℃.
- The maximum substrate capacity dimensions: 12.5(L)x12.5(W) INCH
- Equipment Spec.: A. Wafer size: 8 inches & 12 inches / B. Dimensions (WxDxH, cm): 295x117x201 / C. Weight (kg): 680
製品情報
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MANUFACTURER
SIKAMA -
MANUFACTURING PROCESS
WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping -
Details
Reflow Oven(Top and Bottom Hot Plate Design)
