Minami Ball Inspection & Rework MK-BP5000IR
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機能・特性
- New Transfer system: Dual Table Transfer System provides stable quality and high productivity.
- Solder ball Inspection System :High speed & accuracy inspection
- Solder Ball Rework System: Rework Ball Size： φ45µm～φ600µm Rework missing ball, double ball, misalignment
- Repeatability accuracy：±10µm
製品情報
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MANUFACTURER
Minami -
MANUFACTURING PROCESS
BGA/WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping -
DETAILS
Ball Inspection & Rework
営業担当者
お気軽にお問い合わせ・ご相談ください
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Yarny Lin
- Tel : 03-5530377 ext.103
- Mail : Yarny_Lin@tkk.com.tw
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Larry Chuang
- Tel : 07-3663308
- Mail : Larry_Chuang@tkk.com.tw
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Joyce Peng
- Tel : 03-5530377 ext.103
- Mail : Joyce_Peng@tkk.com.tw
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Criss Wu
- Tel : 03-5530377 ext.104
- Mail : Criss_Wu@tkk.com.tw
