Minami Ball Mounter MK-BP2000
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機能・特性
- Suitable for solder ball placement on wafers up to 12 inches or substrates up to 300 × 300 mm.
- Each main drive unit is controlled by servo motors to ensure high performance and high placement accuracy.
- The solder ball placement head uses a cyclone separation method to achieve stable ball placement and supply without damaging or deforming the solder balls.
- The adjustable gap between the printed workpiece and stencil prevents stencil contamination, enabling continuous operation.
- The seamless ball placement design eliminates the risk of mixing solder balls of different sizes.
製品情報
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MANUFACTURER
Minami -
MANUFACTURING PROCESS
BGA/WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping -
DETAILS
Solder ball placing machine with a built-in high precision general purpose screen printer
営業担当者
お気軽にお問い合わせ・ご相談ください
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Yarny Lin
- Tel : 03-5530377 ext.103
- Mail : Yarny_Lin@tkk.com.tw
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Larry Chuang
- Tel : 07-3663308
- Mail : Larry_Chuang@tkk.com.tw
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Joyce Peng
- Tel : 03-5530377 ext.103
- Mail : Joyce_Peng@tkk.com.tw
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Criss Wu
- Tel : 03-5530377 ext.104
- Mail : Criss_Wu@tkk.com.tw
