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SIKAMA Reflow Oven UP1200

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Features
  • The maximum temperature up to 400℃ and temperature uniformity ±2℃.
  • The maximum substrate capacity dimensions: 12.5(L)x12.5(W) INCH
  • Equipment Spec.: A. Wafer size: 8 inches & 12 inches / B. Dimensions (WxDxH, cm): 295x117x201 / C. Weight (kg): 680
Product Information
  • MANUFACTURER
    SIKAMA
  • MANUFACTURING PROCESS
    WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping
  • Details
    Reflow Oven(Top and Bottom Hot Plate Design)
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw