Language
ALL
  • ALL
  • Manufacturing Process
  • Manufacturer
back
Semtek Carrier Cleaner

1 2
Features
Product Information
  • MANUFACTURER
    Semtek
  • MANUFACTURING PROCESS
    WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping
  • PRODUCT
    DIW is used throughout the clean process, carrier such as Magazine, Boat/Jig, Frame CST, Tray CST
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw