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Minami Ball Inspection & Rework MK-BP5000IR

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Features
  • New Transfer system: Dual Table Transfer System provides stable quality and high productivity.
  • Solder ball Inspection System :High speed & accuracy inspection
  • Solder Ball Rework System 　Rework Ball Size： φ45µm～φ600µm Rework missing ball, double ball, misalignment
  • Repeatability accuracy：±10µm
Product Information
  • MANUFACTURER
    Minami
  • MANUFACTURING PROCESS
    BGA/WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping
  • DETAILS
    Ball Inspection & Rework
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Larry Chuang
    • Tel : 07-3663308
    • Mail : Larry_Chuang@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw