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Minami Ball Mounter MK-BP2000

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Features
  • Suitable for solder ball placement on wafers up to 12 inches or substrates up to 300 × 300 mm.
  • Each main drive unit is controlled by servo motors to ensure high performance and high placement accuracy.
  • The solder ball placement head uses a cyclone separation method to achieve stable ball placement and supply without damaging or deforming the solder balls.
  • The adjustable gap between the printed workpiece and stencil prevents stencil contamination, enabling continuous operation.
  • The seamless ball placement design eliminates the risk of mixing solder balls of different sizes.
Product Information
  • MANUFACTURER
    Minami
  • MANUFACTURING PROCESS
    BGA/WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping
  • DETAILS
    Solder ball placing machine with a built-in high precision general purpose screen printer
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Larry Chuang
    • Tel : 07-3663308
    • Mail : Larry_Chuang@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw