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Hirata Wafer EFEM

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Features
  • Minimum Footprint: Enables the flexible arrangement of robots, load ports and hands.
  • High Throughput: Smooth and High Speed wafer handling with AC servo system and control.
  • Strongly-built slider: Robust rack & pinion ensures quiet driving and lubrication-free.
  • Meets Customer's Requirement with Various Options
  • Particle Free: Proven Clean FOUP Opener, Smooth down air flow Enclosure & High Clean Robot.
Product Information
  • MANUFACTURER
    Hirata
  • MANUFACTURING PROCESS
    WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping
  • DETAILS
    Equipment Front End Module (EFEM) provides automatic and integrated services that accommodate different wafer sizes.
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Larry Chuang
    • Tel : 07-3663308
    • Mail : Larry_Chuang@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw