Language
ALL
  • ALL
  • Manufacturing Process
  • Manufacturer
back
Sikama Flux Coater Falcon ICS412

1 2
Features
  • Suitable for wafer bump flux coating, programmable drive servo speed 1-2000 rpm
  • The maximum substrate capacity dimensions: 8(L)x11(W) INCH
  • In-line transmission, can be used with various conveyors (such as robot, wafer transfer... etc.)
  • Equipment Spec.: A. Wafer size: 4 inches to 8 inches / B. Dimensions (WxDxH, cm): 109x107x104
Product Information
  • MANUFACTURER
    SIKAMA
  • MANUFACTURING PROCESS
    WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping
  • Details
    It can be used with electronic scales and flux systems.
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw