Language
ALL
  • ALL
  • Manufacturing Process
  • Manufacturer
back
WEISUN Full-Automation Oven(Wafer Type)

1 2
Features
  • EFEM(IPC Base, Robot,Load-port,Alinger, X-table & S/W Integration), High steady & Good S/W solution. Suit for 8
  • Full-Automation, Integrate EFEM & Oven, data upload to Server directly, attain Unmaaned status(non-operator)
  • Program: GUI Interface, For
  • Temperature: RT~600℃ & Uniformity: +/- 2℃ & O2 Density: < 20 ppm & Cooling: N2 Air & Water Cooling-down & Capacity: Wafer Q`ty, Single chamber: 50 pcs & Twin-Chamber: 100 pcs & Adapter EQ: EFEM(OHT) / AGV / MGV
Product Information
  • Manufacturer
    WEISUN APPARATUS CO.,LTD.
  • Manufacturing process
    Wafer Level Curing (PR/PI Curing or Focus on Bumping/WLCSP)
  • Product
    Auto-Oven
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Joe Chiu
    • Tel : 03-3529332 ext. 704
    • Mail : joe_chiu@tkk.com.tw
  • CONTACT
    Darren Hsu
    • Tel : 03-3529332 ext.700
    • Mail : darren_hsu@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw