Language
ALL
  • ALL
  • Manufacturing Process
  • Manufacturer
Cedatec Multilayer Inductive Bonding model 200

1 2
Features
  • By inductive-magnetic heating system, there's no limit on layer-count. The most advanced 8G induction bonding system is faster in heating rate 50% more than previous generation with a low-power consumption.
Product Information
  • Manufacturer
    Cedatec
  • Manufacturing process
    Lamination/Drilling/Routing process
  • Product
    Multilayer Inductive Bonding model 200
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • Andy Hsu
    • Tel : 03-3529332 ext.626
    • Mail : andy_hsu@tkk.com.tw
  • charles chien
    • Tel : 03-3529332 ext.624
    • Mail : charles_chien@tkk.com.tw
  • Peter Liao
    • Tel : 03-3529332 ext.623
    • Mail : Peter_Liao@tkk.com.tw